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> If you need to rework the QFN part the key is to FLOOD the footprint with good solder flux from a syringe.

I've never tried this but this makes a lot of sense in my mind's eye. I'll try this next time I have such an issue.

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TQFP seems nice because I can sloppily shove tons of solder down, and then just wick up all the excess solder with solder wick. In fact, I purposefully over-solder all the TQFP joints for this practice. (Too much solder during reflow, and then just a quick cleanup step with a soldering iron later).



Yeah I've been seeing a bunch of chip swaps that use this method, its wild how forgiving it appears to be.




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