> The A4/A5 flash is also integrated into the same package as the CPU(s)
Really? That would be by far the most aggressive die stacking I've ever heard of, if true. I thought it was soldered to the motherboard in stacks of 2-4 dice.
See step 16 of iFixit's iPad teardown. Looks like both ram and flash are separate assemblies. Only the iPhone has the ram integrated with the CPU package.
Really? That would be by far the most aggressive die stacking I've ever heard of, if true. I thought it was soldered to the motherboard in stacks of 2-4 dice.